T4W Polishing pad sponge ”profiled” M14 / black

Polishing Pad T4W is designed for efficient polishing of painted coatings. It is adapted to existing on the market polishing systems, which work with both rotary and orbital machines, wet and dry and speed range 300-2500rpm.

This product is distinguished by a characteristic spherical cavity in the working surface. While increasing machine speed the concavity changes its properties: At low speeds it avoids polishing compound from splashing, at high speed range this shape keeps the compound on the circuit where the molecules are quickly worked out what shortens the processing time.

Features:

• White pad is designed for use with first and second step polishing compounds. Foam structure maintains the compound on the surface of the sponge which provides accurate developing particles and full utilization of the compound
• Orange pad is designed for use with first and second step polishing compounds. Foam structure maintains the paste on the surface of the sponge what provides accurate developing particles and full utilization of the paste
• Yellow pad is designed to work with the second step polishing compounds. Foam structure maintains the paste on the surface of the pad which provides accurate developing particles and full utilization of the paste
• Black polishing pad is designed to work with last step polishing compounds. The structure of the foam quickly gives off heat.

Foam:

• Optimal selected shapes
• The homogeneous structure of high strength
• Specially shaped surface
• Proper hardness

Mounting:

• M14 handle is made of ABS plastic with high impact.

Connection:

• Resistance to temperature, aqueous environment and organic solvents

The product shows the resistance to prolonged exposure to temperatures up to 110 ° C.